Publikationen
Als eines der weltweit führenden Zentren für Photomasken der jeweils neuesten Generation hat das AMTC seinen Tätigkeitsschwerpunkt im Forschungs- und Entwicklungsbereich der Photomasken- und Halbleiterbranche. Die Ergebnisse der F&E Aktivitäten werden unter anderem auf internationalen Konferenzen vorgestellt.
Nachfolgend sind Publikationen aufgelistet, die AMTC-bezogene Forschungsergebnisse enthalten.
Publikationen
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Spezielle Auszeichnungen
Photomask Technology 2011: 2nd place at best paper award
More than monitoring: advanced lithographic process tuning
G. R. Cantrell, Jo Alvin Dumaya, Christian Bürgel, Axel Feicke, Martin Häcker, Clemens Utzny
Photomask Technology 2018: Best Poster
Multiple exposure on single blank for electron-beam writer characterization
André Eilert, Michael Finken, Christian Bürgel, Mark Herrmann, Ronald Hellriegel, Rico Nestler, Oliver Löffler, Frank Hübenthal, Rico Büttner, Katja Steidel
Proc. SPIE. 10810,
EMLC 2017: Best Paper
Splendidly blended: a machine learning set up for CDU control
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Publikationen - 2020
Folgen
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Publikationen - 2019
Proceedings Paper + Presentation | 26 September 2019
Loading effect correction set up by supplementing CD measurement analysis with machine learning
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11148, Photomask Technology 2019
KEYWORDS: Convolution, Critical dimension metrology, Environmental sensing, Etching, Machine learning, Manufacturing, Photomasks, Quality measurement, Scanning electron microscopy, Semiconductors
Proceedings Paper | 29 August 2019
Necessity is the mother of invention: support vector machines for CD control
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11177, 35th European Mask and Lithography Conference (EMLC 2019)
KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Machine learning, Optical inspection, Performance modeling, Process control, Solids, Visualization
Proceedings Paper | 27 June 2019
Masashi Yonetani, Karen Badger, Jed Rankin, Shinji Akima, Yusuke Toda, Itaru Yoshida, Masayuki Kagawa, Takeshi Isogawa, Yutaka Kodera, Jan Heumann, Anka Birnstein
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Defect detection, Defect inspection, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Opacity, Optical inspection, Photomasks, Signal detection
Proceedings Paper | 27 June 2019
Deal gently with the bird you are trying to catch: small scale CD control with machine learning
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Detection and tracking algorithms, Machine learning, Optical inspection, Process control, Solids, Visualization
Proceedings Paper | 27 June 2019
Lifetime test on EUV photomask with EBL2
Chien-Ching Wu, Markus Bender, Rik Jonckheere, Frank Scholze, Herman Bekman, Michel van Putten, Rory de Zanger, Rob Ebeling, Jeroen Westerhout, Kyri Nicolai, Jacqueline van Veldhoven, Véronique de Rooij-Lohmann, Olaf Kievit, Alex Deutz
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Oxidation, Photomasks, Reflectivity, Ruthenium, Scanners
Proceedings Paper + Presentation | 1 May 2019
Experimental Investigation of a high-κ reticle absorber system for EUV lithography
Jo Finders, Robbert de Kruif, Frank Timmermans, Jara García Santaclara, Brid Connely, Markus Bender, Frank Schurack, Takahiro Onoue, Yohei Ikebe, Dave Farrar
Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X
KEYWORDS: Absorption, Diffraction, Distortion, Etching, Extreme ultraviolet lithography, Photomasks, Refractive index, Reticles, Scanners, Tantalum
Proceedings Paper + Presentation | 26 September 2019
Loading effect correction set up by supplementing CD measurement analysis with machine learning
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11148, Photomask Technology 2019
KEYWORDS: Convolution, Critical dimension metrology, Environmental sensing, Etching, Machine learning, Manufacturing, Photomasks, Quality measurement, Scanning electron microscopy, Semiconductors
Proceedings Paper | 29 August 2019
Necessity is the mother of invention: support vector machines for CD control
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11177, 35th European Mask and Lithography Conference (EMLC 2019)
KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Machine learning, Optical inspection, Performance modeling, Process control, Solids, Visualization
Proceedings Paper | 27 June 2019
Masashi Yonetani, Karen Badger, Jed Rankin, Shinji Akima, Yusuke Toda, Itaru Yoshida, Masayuki Kagawa, Takeshi Isogawa, Yutaka Kodera, Jan Heumann, Anka Birnstein
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Defect detection, Defect inspection, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Opacity, Optical inspection, Photomasks, Signal detection
Proceedings Paper | 27 June 2019
Deal gently with the bird you are trying to catch: small scale CD control with machine learning
Christian Bürgel, Martin Sczyrba, Clemens Utzny
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Detection and tracking algorithms, Machine learning, Optical inspection, Process control, Solids, Visualization
Proceedings Paper | 27 June 2019
Lifetime test on EUV photomask with EBL2
Chien-Ching Wu, Markus Bender, Rik Jonckheere, Frank Scholze, Herman Bekman, Michel van Putten, Rory de Zanger, Rob Ebeling, Jeroen Westerhout, Kyri Nicolai, Jacqueline van Veldhoven, Véronique de Rooij-Lohmann, Olaf Kievit, Alex Deutz
Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Oxidation, Photomasks, Reflectivity, Ruthenium, Scanners
Proceedings Paper + Presentation | 1 May 2019
Experimental Investigation of a high-κ reticle absorber system for EUV lithography
Jo Finders, Robbert de Kruif, Frank Timmermans, Jara García Santaclara, Brid Connely, Markus Bender, Frank Schurack, Takahiro Onoue, Yohei Ikebe, Dave Farrar
Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X
KEYWORDS: Absorption, Diffraction, Distortion, Etching, Extreme ultraviolet lithography, Photomasks, Refractive index, Reticles, Scanners, Tantalum
Proceedings Paper + Presentation | 26 March 2019
Towards ultimate image placement accuracy for EUV mask writing with pattern shift process
Vadim Sidorkin, Stephan Zimmermann, Stefan Proske, Michael Finken, G. Cantrell, Markus Bender
Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X
KEYWORDS: Electron beam lithography, Extreme ultraviolet, Metrology, Photomasks, Reticles
Proceedings Paper + Presentation | 26 March 2019
Towards ultimate image placement accuracy for EUV mask writing with pattern shift process
Vadim Sidorkin, Stephan Zimmermann, Stefan Proske, Michael Finken, G. Cantrell, Markus Bender
Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X
KEYWORDS: Electron beam lithography, Extreme ultraviolet, Metrology, Photomasks, Reticles
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Publikationen - 2018
Proceedings Paper + Presentation | 12 November 2018
Mask process correction validation for multi-beam mask lithography
Ingo Bork, Peter Buck, Christian Bürgel, Bhardwaj Durvasula, Stefan Eder-Kapl, Peter Hudek, Michal Jurkovic, Jan Klikovits, Elmar Platzgummer, Jed Rankin, Rao Nageswara, Murali Reddy, Christoph Spengler
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Cadmium, Calibration, Data modeling, Double patterning technology, Etching, Lithography, Photomasks, Scanning electron microscopy, SRAF, Vestigial sideband modulation
Proceedings Presentation | 12 October 2018
Minimizing tone reversal during 19x nm mask inspection: PMJ18 Best Paper (Conference Presentation)
Masashi Yonetani, Kazunori Seki, Karen Badger, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Defect detection, EUV optics, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Lithography, Optical inspection, Photomasks, Semiconducting wafers, Wafer-level optics
Proceedings Paper + Presentation | 3 October 2018
Karen Badger, Masashi Yonetani, Yusuke Toda, Masayuki Kagawa, Takeshi Isogawa, Jan Heumann
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Defect detection, Defect inspection, EUV optics, Extreme ultraviolet, Inspection, Inspection equipment, Optical inspection, Photomasks, Polarization, Semiconducting wafers
Proceedings Paper + Presentation | 3 October 2018
Multiple exposure on single blank for electron-beam writer characterization
André Eilert, Michael Finken, Christian Bürgel, Mark Herrmann, Ronald Hellriegel, Rico Nestler, Oliver Löffler, Frank Hübenthal, Rico Büttner, Katja Steidel
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Critical dimension metrology, Critical dimension scanning electron microscopy, Electron beam lithography, Electron beams, Electrons, Materials processing, Optical proximity correction, Photomasks, Photoresist processing, Scatterometry, Thin films
Proceedings Paper | 3 October 2018
Applying MPC for EUV mask fabrication
Dai Tsunoda, Yohei Torigoe, Yutaro Sato, Masakazu Hamaji, Gek-Soon Chua, Christian Bürgel
Proc. SPIE. 10810, Photomask Technology 2018
KEYWORDS: Calibration, Critical dimension metrology, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, Mask making, Photomasks
Proceedings Paper | 19 September 2018
Deposition durability of e-beam mask repair
Thorsten Krome, Christian Holfeld, Tim Göhler, Pavel Nesladek
Proc. SPIE. 10775, 34th European Mask and Lithography Conference
KEYWORDS: Binary data, Chemistry, Deep ultraviolet, Mask cleaning, Opacity, Ozone, Phase shifts, Photomasks, Printing, Semiconducting wafers
Proceedings Paper | 19 September 2018
Machine learning methods applied to process qualification
Mark Herrmann, Stefan Meusemann, Clemens Utzny
Proc. SPIE. 10775, 34th European Mask and Lithography Conference
KEYWORDS: Critical dimension metrology, Data modeling, Distance measurement, Machine learning, Performance modeling, Photomasks, Principal component analysis, Statistical analysis, Statistical modeling
Proceedings Paper + Presentation | 2 August 2018
Shimon Levi, Ishai Swrtsband, Vladislav Kaplan, Ilan Englard, Kurt Ronse, Bogumila Kutrzeba-Kotowska , Gaoliang Dai, Frank Scholze, Kenslea Anne, Hayley Johanesen, Laurens Kwakman, Igor Turovets, Maxim Rabinovitch, Sven Krannich, Nikolai Kasper, Brid Connolly, Romy Wende, Markus Bender
Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII
KEYWORDS: Atomic force microscopy, Etching, Extreme ultraviolet, Metrology, Photomasks, Semiconducting wafers, Signal processing, Transmission electron microscopy
Proceedings Paper | 12 June 2018
Minimizing "Tone Reversal" during 19x nm mask inspection
Kazunori Seki, Karen Badger, Masashi Yonetani, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera
Proc. SPIE. 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Deep ultraviolet, Defect detection, Defect inspection, EUV optics, Extreme ultraviolet, Inspection, Opacity, Photomasks, Polarization
Proceedings Paper | 12 June 2018
Pavel Nesládek, Jonas Schmidt, Thorsten Krome
Proc. SPIE. 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Atomic force microscopy, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, Manufacturing, Photomasks, Reflectivity, Ruthenium, Ultraviolet radiation
Proceedings Paper | 20 March 2018
Thomas Thamm, Bernd Geh, Marija Djordjevic Kaufmann, Rolf Seltmann, Alla Bitensky, Martin Sczyrba, Aravind Narayana Samy
Proc. SPIE. 10587, Optical Microlithography XXXI
KEYWORDS: Light scattering, Lithography, Logic devices, Photomasks, Reticles, Scanners, Scattering, Source mask optimization
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Publikationen - 2017
Proceedings Paper | 28 September 2017
Splendidly blended: a machine learning set up for CDU control
Proc. SPIE. 10446, 33rd European Mask and Lithography Conference
KEYWORDS: Artificial intelligence, Critical dimension metrology, Evolutionary algorithms, Internet, Machine learning, Manufacturing, Photomasks, Process control, Semiconductors, Statistical analysis
Proceedings Paper | 28 September 2017
Half circle chrome loss by electrochemical effects
Proc. SPIE. 10446, 33rd European Mask and Lithography Conference
KEYWORDS: Electrochemical etching, Phase shifts, Photomasks
Proceedings Paper | 13 July 2017
EUV repair process optimization and integration
Pavel Nesládek, Alexander Lajn, Thorsten Schedel, Markus Bender
Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Critical dimension metrology, Etching, EUV optics, Extreme ultraviolet, Lithography, Manufacturing, Mirrors, Optics manufacturing, Photomasks, Ruthenium
Proceedings Paper | 13 July 2017
Effects of hard mask etch on final topography of advanced phase shift masks
Olga Hortenbach, Haiko Rolff, Alexander Lajn, Martin Baessler
Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Atomic force microscopy, Chromium, Critical dimension metrology, Diffractive optical elements, Etching, Molybdenum, Oxygen, Phase shifts, Photomasks, Reactive ion etching, Scanning electron microscopy
Proceedings Paper | 13 July 2017
Etch bias inversion during EUV mask ARC etch
Alexander Lajn, Haiko Rolff, Richard Wistrom
Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology
KEYWORDS: Chemistry, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Oxygen, Photomask technology, Photomasks, Photoresist processing, Polymers, Process control
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Publikationen - 2010
EMLC 2010SPIE 2010
© 2010 Society of Photo-Optical Instrumentation Engineers (SPIE)
PMJ 2010© 2010 Photomasks Japan
BACUS 2010- Multi-Shaped E-Beam Technology for Mask Writing (649,9 KiB)
- A Systematic Approach to the Determination of SRAF Capabilities in High End Mask Manufacturing (1,5 MiB)
- How to Match Without Copying - An Approach for APSM Mask Process Matching Using Aerial Imaging (822,5 KiB)
- Detecting Measurement Outliers - Remeasure Efficiently (366,9 KiB)
- Improving Registration Measurement Capability by Defining a 2D Grid Standard Using Multiple Registration Measurement Tools (212,7 KiB)
- CD Inspection by Nuflare NPI 6000 Tool (420,5 KiB)
- Using Principal Component Analysis for Photomask CD Signature Investigation (388,5 KiB)
© 2010 Society of Photo-Optical Instrumentation Engineers (SPIE)
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Publikationen - 2009